A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

C Chen; Z Chen; Deep Bera; E Noothout; ZY Chang; ML Tan; Rik Vos; Hans Bosch; Martin Verweij; Nico Jong; MAP Pertijs

doi:10.1109/ISSCC.2018.8310246

A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

C Chen, Z Chen, Deep Bera, E Noothout, ZY Chang, ML Tan, Rik Vos, Hans Bosch, Martin Verweij, Nico Jong, MAP Pertijs

Cardiology

Research output: Chapter/Conference proceeding › Conference proceeding › Academic › peer-review

17 Citations (Scopus)

Original language	English
Title of host publication	2018 IEEE International Solid-State Circuits Conference - (ISSCC)
Place of Publication	New York
DOIs	https://doi.org/10.1109/ISSCC.2018.8310246
Publication status	Published - 2018

Bibliographical note

ISI Document Delivery No.: BK1TX Times Cited: 0 Cited Reference Count: 7

Research programs

EMC COEUR-09

Access to Document

10.1109/ISSCC.2018.8310246

http://hdl.handle.net/1765/106271

Cite this

@inproceedings{c4bc7cc9420a4fa7b6253121c4da8247,

title = "A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes",

author = "C Chen and Z Chen and Deep Bera and E Noothout and ZY Chang and ML Tan and Rik Vos and Hans Bosch and Martin Verweij and Nico Jong and MAP Pertijs",

note = "ISI Document Delivery No.: BK1TX Times Cited: 0 Cited Reference Count: 7",

year = "2018",

doi = "10.1109/ISSCC.2018.8310246",

language = "English",

isbn = "9781509049400",

booktitle = "2018 IEEE International Solid-State Circuits Conference - (ISSCC)",

}

TY - GEN

T1 - A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

AU - Chen, C

AU - Chen, Z

AU - Bera, Deep

AU - Noothout, E

AU - Chang, ZY

AU - Tan, ML

AU - Vos, Rik

AU - Bosch, Hans

AU - Verweij, Martin

AU - Jong, Nico

AU - Pertijs, MAP

N1 - ISI Document Delivery No.: BK1TX Times Cited: 0 Cited Reference Count: 7

PY - 2018

Y1 - 2018

U2 - 10.1109/ISSCC.2018.8310246

DO - 10.1109/ISSCC.2018.8310246

M3 - Conference proceeding

SN - 9781509049400

BT - 2018 IEEE International Solid-State Circuits Conference - (ISSCC)

CY - New York

ER -