A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm2 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer

Nuriel N.M. Rozsa, Zhao Chen, Taehoon Kim, Peng Guo, Yannick Hopf, Jason Voorneveld, Djalma Simoes Dos Santos, Emile Noothout, Zu Yao Chang, Chao Chen, Vincent A. Henneken, Nico De Jong, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Michiel A.P. Pertijs

Research output: Chapter/Conference proceedingConference proceedingAcademicpeer-review

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Abstract

This work presents an ultrasound imaging chip with a monolithically integrated 32×64 element CMUT array, capable of imaging a large 60°×60°×10 cm field-of-view (Fo V) at 2000 vol/s, the highest 3D volume rate reported to date. By combining 2x time-division multiplexing (TDM) with 2×2-element micro-beamforming, it reduces the output channel-count 8x. Equalization (EQ), trained using a pseudo-random bit-sequence (PRBS) generated on-chip, reduces TDM-induced crosstalk by 19 dB, enabling power-efficient scaling of the cable drivers. A novel transmit (TX) beamformer, implemented as a programmable digital pipeline, enables arbitrary TX beamforming with arbitrary pulse-density modulated (PDM) waveforms and drives element-level 65 V unipolar pulsers. The chip features a layout matched to the 365-um-pitch CMUT array, and consumes 1.30 mW/ch.

Original languageEnglish
Title of host publication2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages2
ISBN (Electronic)9798350361469
DOIs
Publication statusPublished - 26 Aug 2024
Event2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024 - Honolulu, United States
Duration: 16 Jun 202420 Jun 2024

Publication series

SeriesDigest of Technical Papers - Symposium on VLSI Technology
ISSN0743-1562

Conference

Conference2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024
Country/TerritoryUnited States
CityHonolulu
Period16/06/2420/06/24

Bibliographical note

Publisher Copyright: © 2024 IEEE.

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