TY - JOUR
T1 - A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography
AU - Hopf, Yannick M.
AU - Ossenkoppele, Boudewine W.
AU - Soozande, Mehdi
AU - Noothout, Emile
AU - Chang, Zu-Yao
AU - Chen, Chao
AU - Vos, Hendrik J.
AU - Bosch, Johan G.
AU - Verweij, Martin D.
AU - de Jong, Nico
AU - Pertijs, Michiel A. P.
N1 - Publisher Copyright:
© 1966-2012 IEEE.
PY - 2022
Y1 - 2022
N2 - In this article, an application-specific integrated circuit (ASIC) for 3-D, high-frame-rate ultrasound imaging probes is presented. The design is the first to combine element-level, high-voltage (HV) transmitters and analog front-ends, subarray beamforming, and in-probe digitization in a scalable fashion for catheter-based probes. The integration challenge is met by a hybrid analog-to-digital converter (ADC), combining an efficient charge-sharing successive approximation register (SAR) first stage and a compact single-slope (SS) second stage. Application in large ultrasound imaging arrays is facilitated by directly interfacing the ADC with a charge-domain subarray beamformer, locally calibrating interstage gain errors and generating the SAR reference using a power-efficient local reference generator. Additional hardware-sharing between neighboring channels ultimately leads to the lowest reported area and power consumption across miniature ultrasound probe ADCs. A pitch-matched design is further enabled by an efficient split between the core circuitry and a periphery block, the latter including a datalink performing clock data recovery (CDR) and time-division multiplexing (TDM), which leads to a 12-fold total channel count reduction. A prototype of 8x9 elements was fabricated in a TSMC 0.18-pm HV BCD technology and a 2-D PZT transducer matrix with a pitch of 160 pm, and a center frequency of 6 MHz was manufactured on the chip. The imaging device operates at up to 1000 volumes/s, generates 65-V transmit pulses, and has a receive power consumption of only 1.23 mW/element. The functionality has been demonstrated electrically as well as in acoustic and imaging experiments.
AB - In this article, an application-specific integrated circuit (ASIC) for 3-D, high-frame-rate ultrasound imaging probes is presented. The design is the first to combine element-level, high-voltage (HV) transmitters and analog front-ends, subarray beamforming, and in-probe digitization in a scalable fashion for catheter-based probes. The integration challenge is met by a hybrid analog-to-digital converter (ADC), combining an efficient charge-sharing successive approximation register (SAR) first stage and a compact single-slope (SS) second stage. Application in large ultrasound imaging arrays is facilitated by directly interfacing the ADC with a charge-domain subarray beamformer, locally calibrating interstage gain errors and generating the SAR reference using a power-efficient local reference generator. Additional hardware-sharing between neighboring channels ultimately leads to the lowest reported area and power consumption across miniature ultrasound probe ADCs. A pitch-matched design is further enabled by an efficient split between the core circuitry and a periphery block, the latter including a datalink performing clock data recovery (CDR) and time-division multiplexing (TDM), which leads to a 12-fold total channel count reduction. A prototype of 8x9 elements was fabricated in a TSMC 0.18-pm HV BCD technology and a 2-D PZT transducer matrix with a pitch of 160 pm, and a center frequency of 6 MHz was manufactured on the chip. The imaging device operates at up to 1000 volumes/s, generates 65-V transmit pulses, and has a receive power consumption of only 1.23 mW/element. The functionality has been demonstrated electrically as well as in acoustic and imaging experiments.
UR - https://www.scopus.com/pages/publications/85137887301
U2 - 10.1109/JSSC.2022.3201758
DO - 10.1109/JSSC.2022.3201758
M3 - Article
SN - 0018-9200
VL - 57
SP - 3228
EP - 3242
JO - IEEE Journal of Solid-State Circuits
JF - IEEE Journal of Solid-State Circuits
IS - 11
ER -